Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2505308
Kind Code:
B2
Abstract:
A semiconductor device comprises a plurality of semiconductor chips (1a, 1b, 1c), electrodes formed on circuit surfaces of said plurality of semiconductor chips (1a, 1b, 1c); inner leads (3a, 3b) made of a metal foil and bonded at one ends thereof to the electrodes, outer leads (4, 4a, 4b, 4c) bonded at one ends thereof to the other ends of the inner leads (3a, 3b), and a sealing material (5) sealing said plurality of semiconductor chips (1a, 1b, 1c), the electrodes, the inner leads, and part of each of the outer leads. The semiconductor chips (1a, 1b, 1c) are laminated in such a manner that those surfaces of the semiconductor chips (1a, 1b, 1c) on which their respective circuits are formed are disposed in facing relation to each other. This provides a semiconductor device which is excellent in assembling efficiency.
Inventors:
NISHIMURA ASAO
KITANO MAKOTO
YAGUCHI AKIHIRO
YONEDA NAE
KONO RYUJI
MURAKAMI HAJIME
ANJO ICHIRO
KITANO MAKOTO
YAGUCHI AKIHIRO
YONEDA NAE
KONO RYUJI
MURAKAMI HAJIME
ANJO ICHIRO
Application Number:
JP23671190A
Publication Date:
June 05, 1996
Filing Date:
September 06, 1990
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L25/18; H01L23/28; H01L23/495; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP1184860A | ||||
| JP1191462A | ||||
| JP2174240A | ||||
| JP61248541A | ||||
| JP58106951U |
Attorney, Agent or Firm:
Unuma Tatsuyuki