Title:
EPOXY RESIN COMPOSITION AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JP2506007
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition improved in heat resistance, toughness, dielectric constant, etc., by thermally melt kneading with heat an epoxy resin, a curing agent and an epoxy resin-modified product produced by reacting the epoxy resin with a specific aramide-polysiloxane block copolymer.
CONSTITUTION: The objective composition suitable for semiconductor-sealing materials and powder coatings comprises (A) an epoxy resin-modified product, (B) an epoxy resin, and (C) a curing agent such as bis(4-aminophenyl) sulfone, the component A being produced by thermally reacting (i) the epoxy resin with (ii) a phenolic hydroxyl group-containing aramide-polysiloxane block copolymer of the formula [m is 0-200; n is 1-200; n/(m+n)=0.01-1; Ar1, Ar2 are divalent aromatic organic group; Ar3 is divalent aromatic organic group containing a phenolic hydroxyl group; Y is phenyl group, phenoxy group, 1-10C divalent hydrocarbon group; 1 is 1-200; q is 1-40], and is obtained by thermally melt kneading the components (A), (B) and (C).
Inventors:
KYOHARA TADASHI
Application Number:
JP21419791A
Publication Date:
June 12, 1996
Filing Date:
August 01, 1991
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C08G59/14; C08G59/00; C08G59/20; C08G59/30; C08L63/00; (IPC1-7): C08G59/14; C08G59/20; C08L63/00