Title:
【発明の名称】半導体ウエーハの液処理装置
Document Type and Number:
Japanese Patent JP2593465
Kind Code:
B2
Inventors:
Masaki Takahara
Application Number:
JP1852487A
Publication Date:
March 26, 1997
Filing Date:
January 30, 1987
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G03F7/16; B05C11/08; G03F7/00; G03F7/30; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F7/16
Domestic Patent References:
| JP5745237A | ||||
| JP6095979U | ||||
| JP55181340U |
Attorney, Agent or Firm:
Norio Ogo