Title:
SEMICONDUCTOR RESIN-SEALING MOLDING DIE
Document Type and Number:
Japanese Patent JPH0677268
Kind Code:
A
Abstract:
PURPOSE: To enable a semiconductor resin-sealing molding die to be enhanced in resin efficiency and lessened in runner breakage.
CONSTITUTION: A multi-plunger type resin sealing die is provided, where lead frames 1 and 11 confronting each other are arranged and shifted from each other in an arrangement direction of a cavity 3. A runner 2 serving as a molten resin path extending from a cull 4 to the cavity 3 is rectilinear and short in length.
Inventors:
KIKUCHI TAKESHI
Application Number:
JP22371292A
Publication Date:
March 18, 1994
Filing Date:
August 24, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/56; B29C45/14; (IPC1-7): H01L21/56
Domestic Patent References:
| JPH04251943A | 1992-09-08 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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