Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0661629
Kind Code:
A
Abstract:
PURPOSE: To prevent solder bridge from being formed across adjacent land parts without causing increase of manhours or cost.
CONSTITUTION: Land parts 2 for mounting components 5 are formed on a substrate 1. Solder resist 3 for blocking adhesion of solder is applied on the land pattern. Openings 4 are made through the solder resist 3 at positions corresponding with the land parts 2 thus exposing the land parts 2. Edge of the opening 4 is lapped, with width of at least 50μm, over the peripheral edge of the land part 2 at three sides thereof except one side where the component 5 is stuck. Consequently, the solder resist 3 rises partially along the periphery of the land part 2.
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Inventors:
ARAI MUTSUO
Application Number:
JP21444092A
Publication Date:
March 04, 1994
Filing Date:
August 12, 1992
Export Citation:
Assignee:
UNISIA JECS CORP
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
| JPH0247087B2 | 1990-10-18 | |||
| JP1129873B | ||||
| JPH0265295A | 1990-03-05 |
Attorney, Agent or Firm:
Fujiya Shiga (3 outside)
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