Title:
PACKAGE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0629418
Kind Code:
A
Abstract:
PURPOSE: To reduce a machining area or eliminate the need of a machining process itself, and reduce the cost of a processing.
CONSTITUTION: In a package for electronic components in which there is provided an eyelet having a first surface 11a on which electronic components are placed, and a second surface 11b extending substantially parallely to the first surface surrounding the same and under the peripheral edge of the first surface, and in which the second surface and the lower surface of a flange of a cap 16 are joinned with each other by pressurizing means, a recessed portion 11d is formed in a surface (third surface) 11c opposing to the first surface of the eyelet.
Inventors:
KIMURA YASUYUKI
NAKAMURA YUTAKA
ISHIZAKA KOJI
NAKAMURA YUTAKA
ISHIZAKA KOJI
Application Number:
JP28830492A
Publication Date:
February 04, 1994
Filing Date:
October 27, 1992
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L23/04; H01L23/12; (IPC1-7): H01L23/04; H01L23/12
Attorney, Agent or Firm:
Ariga Gunichiro
Next Patent: KEYBOARD