PURPOSE: To obtain adhesive which can adhere a semiconductor element to a support member at a low temperature in a short time without bleed from paste by incorporating special epoxy resin, curing agent, cure accelerator, special imidazole compound as additive therein.

CONSTITUTION: The adhesive for a semiconductor element comprises mixed epoxy resin which is so prepared as to exhibit a liquid state at an ambient temperature by mixing epoxy resin which is liquid at the ambient temperature or epoxy resin which is solid or semisolid at the ambient temperature and liquid epoxy resin which can dissolve it, curing agent, cure accelerator, and imidazole compound represented by a general formula as shown as additive. A quantity of the additive is set to 0.001-0.01 equivalent with respect to one equivalent of the epoxy resin or the mixed epoxy resin. However, in the formula, R1 and R2 are hydrogen or the same or different alkyl group, and R3 is 11 or more C alkyl group. Further, the adhesive may comprise filler.