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Patent Searching and Data


Title:
HEAT INSULATING MATERIAL BONDING APPARATUS
Document Type and Number:
Japanese Patent JPH0747606
Kind Code:
A
Abstract:

PURPOSE: To enhance heat efficiency by directly heating only a steel panel, in a heat insulating material bonding apparatus wherein an adhesive coating roll, a heating device and a press bonding roll bonding a heat insulating material to the steel panel are successively arranged, by constituting the heating device of an inveter control part supplying a high frequency AC current to a heating coil.

CONSTITUTION: A heat insulating material bonding apparatus 1 is equipped with a pinch roll 4 drawing out a steel panel P from the coil C in an uncoiler 3, an adhesive coating roll 6 coating the steel panel P with an adhesive, a heating device 7 heating the applied adhesive to dry the same and preheating the steel panel P and a pair of front and rear press bonding rolls 9 bonding a heat insulating material T to the steel panel P under pressure. In this case, the heating device 7 is constituted of the heating coil arranged to the upper part within a furnace main body and an inverter supplying a high frequency AC current to the heating coil. The AC magnetic field generated from the heating coil is applied to the steel panel P fed in the heating device 7 to heat the steel panel P by eddy-current loss and the heating temp. of the steel panel P is controlled by adjusting output volume.


Inventors:
SHIMIZU KATSUMI
Application Number:
JP19750493A
Publication Date:
February 21, 1995
Filing Date:
August 09, 1993
Export Citation:
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Assignee:
SHIMIZU KIKAI KK
International Classes:
B29C65/46; B29C65/48; B32B15/08; B32B37/06; B32B43/00; B29L9/00; (IPC1-7): B29C65/46; B29C65/48; B32B15/08; B32B31/26; B32B35/00
Attorney, Agent or Firm:
Arata Nishida (1 person outside)