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Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JPH0647763
Kind Code:
A
Abstract:

PURPOSE: To perform molding of stable quality by controlling the heating temp. or closing speed of a mold corresponding to the change of a molding condition.

CONSTITUTION: A closing position sensor 4 detecting the closing speed of molds 1, 2, a mold inner pressure sensor 5 detecting the pressure in a cavity 3, a resin temp. sensor 6 detecting the temp. of the molding material in the cavity 3 and a mold temp. sensor 7 detecting the temp. of the molds 1, 2 are provided to the molds 1, 2. A control unit controlling the closing speed or heating temp. of the molds 1, 2 on the basis of the detected data due to the sensors 4, 5, 6, 7 is provided. When the pressure or temp. condition acting on the molding material in the cavity 3 changes, the change state is detected by the mold inner pressure sensor 5 or the resin temp. sensor 6 and the detected value is fed back by the closing position sensor 4 or the mold temp. sensor 7 to control the closing speed or heating temp. of the molds 1, 2.


Inventors:
HATTORI KAZUO
Application Number:
JP20557792A
Publication Date:
February 22, 1994
Filing Date:
July 31, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C43/36; B29C43/58; (IPC1-7): B29C43/58; B29C43/36
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)