Title:
RESIN SEALING TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0637221
Kind Code:
A
Abstract:
PURPOSE: To provide a highly reliable resin-sealed type semiconductor device by reducing manufacturing time and by lessening the generation of chip cracks.
CONSTITUTION: A lead frame 1 is arranged in such a manner that its press- punched burr-surface side 5 is facing upward, a semiconductor chip 2 is die- bonded and wire-bonded. Then, a resin-molded layer is formed using epoxy resin and the like. At this time, the semiconductor chip 2 is arranged on the thin-wall side (flat-shaped side), i.e., the burr-surface side of the lead frame 1, and a resin-sealing operation is conducted.
Inventors:
SHIBATA TAKASHI
Application Number:
JP19034992A
Publication Date:
February 10, 1994
Filing Date:
July 17, 1992
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/52; H01L21/56; H01L23/48; (IPC1-7): H01L23/48; H01L21/52; H01L21/56
Attorney, Agent or Firm:
Takehiko Suzue
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