Title:
【発明の名称】半導体集積回路装置の設計方法
Document Type and Number:
Japanese Patent JP2582287
Kind Code:
B2
Inventors:
MURAYAMA TETSUYA
Application Number:
JP28928588A
Publication Date:
February 19, 1997
Filing Date:
November 15, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L27/04; H01L21/822; H03F1/32; H03F1/34; H03F3/45; (IPC1-7): H03F3/45; H01L21/822; H01L27/04
Domestic Patent References:
| JP57186049U | ||||
| JP60137450U |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)