Title:
【考案の名称】半導体集積回路
Document Type and Number:
Japanese Patent JPH0633718
Kind Code:
Y2
Inventors:
Masanori Tanaka
Application Number:
JP5587691U
Publication Date:
August 31, 1994
Filing Date:
June 20, 1991
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H03M5/08; H03M9/00; H04L25/49; (IPC1-7): H03M5/08; H03M9/00; H04L25/49
Domestic Patent References:
| JP60216653A |
Attorney, Agent or Firm:
Shigeki Kawase
Next Patent: 車両の冷却装置