Title:
METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL MOLDING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2522740
Kind Code:
B2
Abstract:
PURPOSE: To mold a title circuit board of high quality efficiently at low cost by using a die to partially press a primary molding circuit board to make ruggedness.
CONSTITUTION: A part to make ruggedness in a primary molding circuit board 27 extracted from a first die is mounted on the top of the released lower force 29 of a second die 28. A heater 32 kept embedded in the lower force 29 and the top force 30 of the die 28 is heated, and the upper force 30 is lowered via a rod 33 by a ram to heat the primary molding circuit board 27 by contact with the heated die. After the part to make ruggedness is heated to be soft enough, pressure is applied through the upper force 30 by the ram to obtain a secondary molding circuit board that is a three-dimensional circuit board rugged in a predetermined point including the part with a conductive circuit transferred. This process enables manufacture of high-quality three-dimensional molding circuit boards free of cuts and wrinkles in transfer sheets, or discontinuity in circuit conductors.
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Inventors:
WATANABE AKIHIKO
KOYAMA HIRONORI
KOYAMA HIRONORI
Application Number:
JP10614392A
Publication Date:
August 07, 1996
Filing Date:
March 31, 1992
Export Citation:
Assignee:
NITSUTO BOSEKI KK
MEIKI SEISAKUSHO KK
MEIKI SEISAKUSHO KK
International Classes:
B29C45/14; B29C45/56; H05K3/20; B29K105/20; B29L31/34; (IPC1-7): H05K3/20; B29C45/14; B29C45/56
Domestic Patent References:
| JP60121791A | ||||
| JP335584A | ||||
| JP2273985A |
Attorney, Agent or Firm:
Kiyoshi Arai