PURPOSE: To improve heat dissipation from a high power circuit in a high power hybrid integrated circuit including a high power circuit and a low power circuit formed therein as well as prevent a solder junction part from being cracked owing to a temperature cycle in the solder junction part of chip parts constructing the low power circuit.

CONSTITUTION: There are formed on the same layer on one principal surface of a substrate 1 a first insulating resin layer 2 having substantially the same film thickness low thermal resistance and a second insulating resin layer 5 having a delay characteristic. Further, a power semiconductor device 6 is mounted on the first insulating resin layer 2 and chip parts 4, etc., are mounted on the second insulating resin layer 5.