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Patent Searching and Data


Title:
MOLDING METHOD FOR MULTILAYER LAMINATED SHEET
Document Type and Number:
Japanese Patent JPH079471
Kind Code:
A
Abstract:

PURPOSE: To prevent an occurrence of wrinkles in a metal foil by a method wherein laminates each obtained by overlapping circuit boards through a prepreg and disposing a metal foil on each outer surface thereof through a prepreg are overlapped alternately with molded plates and pressure molded through cushioning materials, and the compressed amount of the cushioning materials generated at this time is determined to be within a specific range.

CONSTITUTION: A laminate 3 is obtained by overlapping circuit boards 7 provided with inner circuits 6 through a prepreg 8 and disposing a metal foil 5 on each outer surface thereof through a prepreg 8. The laminates 3 are overlapped alternately with molded plates 2 and clamped between hot plates 4 through cushioning materials 1 to be molded under heat and pressure. The thickness (lap number) of the cushioning materials 1 is determined so that the total reduction amount of the cushioning materials 1 in thickness generated at the time of pressur molding is within 15-35% of the total thickness of the inner circuits 6. As the metal foil 5, a copper foil not more than 20μm in thickness is preferably used.


Inventors:
TAKIZAWA HIDEO
Application Number:
JP15244593A
Publication Date:
January 13, 1995
Filing Date:
June 23, 1993
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C43/20; B29C43/32; B32B15/08; H05K3/46; B29K105/06; (IPC1-7): B29C43/32; B29C43/20; H05K3/46
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)