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Patent Searching and Data


Title:
CHIP-TYPE ALUMINUM ELECTROLYTIC CAPACITOR
Document Type and Number:
Japanese Patent JPH0645207
Kind Code:
A
Abstract:

PURPOSE: To enhance strength in a sealing part, increase the heat resistance, and have a room in a condition scope at soldering by a method wherein a thickness in a sealing body is a rubber thickness within a scope of a specific value and a part of a specific value % or more on the upper surface of the sealing part is bound tight by an aluminum case and coated.

CONSTITUTION: A draw-out lead guided from a capacitor element is penetrated into a sealing body having a lead penetrating through hole, and in an electrolytic capacitor receiving a cylindrical metallic case, a rubber having a thickness of 1.20 to 2.00mm is used in the sealing body to coat 60% or more of the upper surface of a rubber in the sealing body with a case binding part of the sealing part. Incidentally, when a coating area to the sealing body is changed to compare, under condition A of a coating area 40%, most of a rubber of a test product is jumped out and inferior in the heat resistance. Also, under condition B of 50%, a rubber is also jumped out, and under condition C of 60% or more, a rubber is not jumped out. Thus, it is possible to enhance the heat resistance, widen a scope of a reflow soldering condition, and enhance reliability.


Inventors:
YAMADA KOSHI
KUROKI NOBUO
TAKAHASHI TOSHIAKI
Application Number:
JP21719292A
Publication Date:
February 18, 1994
Filing Date:
July 22, 1992
Export Citation:
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Assignee:
NICHICON CORP
International Classes:
H01G9/004; H01G9/04; H01G9/10; (IPC1-7): H01G9/10; H01G9/04