PURPOSE: To polish the internal surface of a notch part effectively by pressing a rotating buff against the notch part of a wafer held on a table by a cylinder device, rotating the rotating buff and the table by their respective motors, and applying a pressing force of the rotating buff vertically to the internal surface of the notch.
CONSTITUTION: A wafer is set on a table 2 by vacuum suction, etc., and a part near a notch part 32 of the wafer is positioned on an extension of crankshafts 4a and 4a. Also a rotating buff 7 is pressed against the internal surface of the notch part 32 of the wafer by an air cylinder device 10. Then the outer periphery of the rotating buff 7 is slightly deformed elastically to touch widely on the notch part 32. Next the rotating buff 7 is rotated by an electric motor 8, and the table 2 is turned slowly so that the pressing force of the rotating buff 7 acts vertically against the internal surface of the notch part 32. Thus polishing is made so that the rotating buff 7 follows the internal surface of the notch part 32.
OTANI TATSUO
ICHIKAWA KOICHIRO
NAKAMURA YOSHIO
FUJIKOSHI MACHINERY CORP