Title:
MOUNTING STRUCTURE OF INTERLAYER FILM
Document Type and Number:
Japanese Patent JPH0582355
Kind Code:
A
Abstract:
PURPOSE: To prevent the bonding defect of a film.
CONSTITUTION: A slit 6b in a film 6 is bonded; by an ultrasonic welding operation, to the part of a film 6 in which a winding 5 at the lower part by one layer is not wound; the film 6 is wound. Then, a winding 5 covering one layer is wound on the outside of the film 6; after that, a film 6 is wound on its outside in the same manner. In this way, the winding 5 and the film 6 are wound alternately. Thereby, a winding base end part 6a in the film 6 can be surely brought into contact with the film 6 in the lower part by one layer. As a result, it is possible to prevent a bonding defect in the ultrasonic welding operation.
Inventors:
ISHIKAWA MICHIO
MATSUI ATSUSHI
SATO KUNIHIRO
MATSUI ATSUSHI
SATO KUNIHIRO
Application Number:
JP23963591A
Publication Date:
April 02, 1993
Filing Date:
September 19, 1991
Export Citation:
Assignee:
TDK CORP
International Classes:
H01F5/06; H01F17/04; H01F19/04; H01F27/32; H01F38/42; (IPC1-7): H01F5/06; H01F17/04; H01F19/04
Domestic Patent References:
| JPH0245611B2 | 1990-10-11 |
Attorney, Agent or Firm:
Masayoshi Misawa
Next Patent: COOLING DEVICE OF OIL-FILLED ELECTRIC APPARATUS