Title:
【発明の名称】半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3063840
Kind Code:
B2
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Inventors:
Tatsuya Usami
Application Number:
JP31789297A
Publication Date:
July 12, 2000
Filing Date:
November 19, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L29/78; H01L21/316; H01L21/318; (IPC1-7): H01L21/316; H01L21/318; H01L29/78
Domestic Patent References:
| JP7211694A | ||||
| JP8298260A | ||||
| JP118234A | ||||
| JP11145279A | ||||
| JP9237783A |
Attorney, Agent or Firm:
Yosuke Goto (1 person outside)