Title:
CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3038144
Kind Code:
B2
Abstract:
PURPOSE: To provide a circuit board which can mount electronic parts at a high packing density, can remarkably reduce the sizes of the parts, and hardly cause a stray capacitance.
CONSTITUTION: An insulating circuit board 4 is provided with a circuit pattern 12 formed on the board, soldering lands 12a provided at the end section of the pattern 12, and a plurality of through holes 7 which are formed through the board 4 and connected to the pattern 12. The board 4 is also provided with electronic parts 14 mounted on the board 4 so that the parts can cover the holes 7. The surfaces of the holes 7 for mounting the parts 14 are slightly protruded from the board 4 and electrode sections 14a at both ends of the parts 14 are positioned above the holes 7 and electrically connected to the holes 7 by soldering.
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Inventors:
Kiyoshi Ida
Sakurai Shizuo
Sakae Shinkawa
Youzo Obara
Sakurai Shizuo
Sakae Shinkawa
Youzo Obara
Application Number:
JP35161795A
Publication Date:
May 08, 2000
Filing Date:
December 25, 1995
Export Citation:
Assignee:
Hokuriku Electric Industry Co., Ltd.
International Classes:
H05K1/11; H05K1/18; H05K3/34; H05K3/40; (IPC1-7): H05K1/18; H05K1/11
Domestic Patent References:
| JP51127374A | ||||
| JP60110196A | ||||
| JP5586379U | ||||
| JP61136576U | ||||
| JP4411508B1 |
Attorney, Agent or Firm:
Isao Hirosawa