Title:
ELECTRIC CONNECTING CONSTRUCTION BETWEEN CIRCUIT BOARD AND COMPONENT TO BE LOADED THEREON AND ELECTROMAGNETIC SHIELD CONSTRUCTION USING SAME TOGETHER WITH ELECTRONIC CIRCUIT MODULE PROVIDED WITH ELECTROMAGNETIC SHIELD
Document Type and Number:
Japanese Patent JP3008224
Kind Code:
B2
Abstract:
PURPOSE: To offer an electrically connecting structure able to connect and load electronic components to a substrate while improving certainty of mutual electric continuity by more simple operation.
CONSTITUTION: A hole 8 is provided by making a substrate on a wiring pattern 2 formed on a circuit board 1 so as to go through the board 1 while providing a resin-made projection 10 convered by a conductor film 11 on the lower part of the components to be loaded on the circuit board 1 and tightly fitting the resin-made projection 10 into the hole 8 on the circuit board.
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Inventors:
Takashi Kobayashi
Noboru Takayama
Noboru Takayama
Application Number:
JP25206491A
Publication Date:
February 14, 2000
Filing Date:
September 30, 1991
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/00; (IPC1-7): H01L23/00
Attorney, Agent or Firm:
Minoru Yoshida