Title:
NANO COMPOSITE SOLID LUBRICATING FILM
Document Type and Number:
Japanese Patent JP2016145406
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a nano composite solid lubricating film used for extending the lifetime of a movable member, for example, such as a bearing, chain, piston and joint subjected to sliding friction or rotating friction in the mechanical engineering, especially the auto industry, the aircraft industry and the space industry.SOLUTION: A nano composite solid lubricating film is obtained by alternately laminating a carbon matrix layer 1 including copper particles 2 and an intermediate layer 3 selected from Ti, Zr, Hf or V. The contents of the constituent elements are carbon of 5-35, copper of 50-90 and intermediate layer metal of 5-15 in terms of a bulk ratio at.%. The carbon matrix layer including the copper particles is reinforced by the intermediate layer and has a thickness of 30-150 nm; the thickness of the intermediate layer is 5-20 nm; and the hardness of the film is 200-1000 HV.SELECTED DRAWING: Figure 1
Inventors:
PAVELS NAZAROVS
VALERY MITIN
VLADIMIRS KOVALENKO
VALERY MITIN
VLADIMIRS KOVALENKO
Application Number:
JP2015159760A
Publication Date:
August 12, 2016
Filing Date:
August 13, 2015
Export Citation:
Assignee:
NACO TECH SIA
International Classes:
C23C14/06; C10M103/02; C10M125/04; C23C14/14; C23C14/34; F16C33/10
Domestic Patent References:
| JPH10237627A | 1998-09-08 | |||
| JP2002113604A | 2002-04-16 | |||
| JPH03291379A | 1991-12-20 |
Other References:
W. GULBINSKI ET AL.: "Phase composition and tribological properties of copper/carbon composite films", SURFACE & COATINGS TECHNOLOGY, vol. 200, JPN6016045629, 2005, pages 2016 - 2151, ISSN: 0003448302
THIERRY CABIOCH ET AL.: "Co-sputtering C-Cu thin film synthesis: microstructural study of copper precipitates encapsulated in", PHILOSOPHICAL MAGAZINE B, vol. Volume 79, Number 3, JPN6016045630, March 1999 (1999-03-01), pages 501 - 506, ISSN: 0003448303
THIERRY CABIOCH ET AL.: "Co-sputtering C-Cu thin film synthesis: microstructural study of copper precipitates encapsulated in", PHILOSOPHICAL MAGAZINE B, vol. Volume 79, Number 3, JPN6016045630, March 1999 (1999-03-01), pages 501 - 506, ISSN: 0003448303
Attorney, Agent or Firm:
Hiroe Associates Patent Office