Title:
反応性多層フォイルを用いて形成されるナノ構造はんだ付け又はろう付け接合部
Document Type and Number:
Japanese Patent JP2007502214
Kind Code:
A
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Inventors:
Bethnoin, Etienne
Kunio, Omar
Vice, Timothy, Pea.
One, japin
Kunio, Omar
Vice, Timothy, Pea.
One, japin
Application Number:
JP2006533025A
Publication Date:
February 08, 2007
Filing Date:
May 13, 2004
Export Citation:
Assignee:
Johns Hopkins University
International Classes:
B23K3/04; B23K1/00; B23K31/02; B23K31/12; B23K35/02; B23K35/34; C06B45/14
Domestic Patent References:
| JP2002118353A | 2002-04-19 |
Foreign References:
| WO2001083623A2 | 2001-11-08 |
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Okabe
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Tsuneo Kobayashi
Masami Saito
Katsuhiko Kimura
Nobuaki Kato
Okabe
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Tsuneo Kobayashi
Masami Saito
Katsuhiko Kimura