Title:
NAP INSPECTION METHOD FOR PACKAGE
Document Type and Number:
Japanese Patent JP2520566
Kind Code:
B2
Abstract:
PURPOSE: To allow efficient and sure inspection of micronap through a simple apparatus by projecting a light having directivity to a package and picking up the reflection light from the outline of the package under overexposure.
CONSTITUTION: A light source 2 comprises a halogen lamp 4 and a collimate mirror 5. Parallel light having directivity is projected from the light source 2 onto a package 1 and the end face 1a thereof is illuminated brightly. Luminance of the light source 2 is set such that the illuminance on the end face 1a will be about 5,000lux. An optical sensor 3 is an area sensor 8 comprising a CCD and since the illuminance at the focal point thereof is about 5,000lux, it is overexposed. Since the sensor 3 opposes the outline of the package 3, it has black background so long as no protrusion, e.g. a nap K, is present on the outline. The background is rendered white when the light is reflected on the nap K.
Inventors:
MASAI TETSUJI
Application Number:
JP17893993A
Publication Date:
July 31, 1996
Filing Date:
July 20, 1993
Export Citation:
Assignee:
MURATA MACHINERY LTD
International Classes:
D06H3/08; B65H63/00; G01B11/00; G01N21/89; G01N21/892; (IPC1-7): G01N21/89; D06H3/08
Domestic Patent References:
| JP6353454A | ||||
| JP3255944A |
Attorney, Agent or Firm:
Nobuo Kinutani
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