Title:
NAPHTHOLALDEHYDE CONDENSATE AND EPOXY RESIN COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JPH07216041
Kind Code:
A
Abstract:
PURPOSE: To obtain the subject condensate useful as a curing agent for an epoxy resin composition for sealing a semiconductor, having excellent workability, heat resistance, water-vapor resistance and crack resistance, comprising a specific naphtholaldehyde having a large amount of a dimer.
CONSTITUTION: This condensate is a naphtholaldehyde condensate obtained by condensation of (A) α-naphthol or α-naphthol and β-naphthol and (B) a monoaldehyde such as paraformaldehyde, (hydroxy)benzaldehyde or salicylaldehyde and the amount of a dimer in the condensate is larger than that of a trimer or a tetramer.
Inventors:
NAKA AKIHIRO
ITO SHUICHI
ITO SHUICHI
Application Number:
JP2637494A
Publication Date:
August 15, 1995
Filing Date:
January 28, 1994
Export Citation:
Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
International Classes:
C08G16/02; C08G16/00; C08G59/40; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G16/02; C08G59/40; H01L23/29; H01L23/31