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Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOCURING PATTERN FORMED USING THE SAME, AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2016161938
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition, a photocuring pattern formed using the same, and an image display device.SOLUTION: This invention relates to a negative photosensitive resin composition having excellent substrate adhesion, chemical resistance, storage stability and others, a photocuring pattern formed using the same, and an image display device comprising the pattern.SELECTED DRAWING: None

Inventors:
CHUN JI MIN
KIM SEONG BEEN
CHO YONG-HWAN
Application Number:
JP2016024743A
Publication Date:
September 05, 2016
Filing Date:
February 12, 2016
Export Citation:
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Assignee:
DONGWOO FINE CHEM CO LTD
International Classes:
G03F7/085; C08F220/28; C08F232/04; G02B5/20; G02F1/1339; G03F7/033
Domestic Patent References:
JP2006251385A2006-09-21
JP2012008571A2012-01-12
JP2009223277A2009-10-01
Foreign References:
WO2014136897A12014-09-12
Attorney, Agent or Firm:
Atomi International Patent Office



 
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