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Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022190770
Kind Code:
A
Abstract:
To provide a curable composition which enables production of a cured film that has alkali solubility, enables low temperature curing and is excellent in chemical resistance.SOLUTION: A negative photosensitive resin composition contains the following components (A) to (E). (A) Novolac type phenol having a molar ratio [(a1): (a2): (a3)] of a structural unit (a1) derived from m-cresol, a structural unit (a2) derived from benzaldehyde and a structural unit (a3) derived from salicylaldehyde of 1.0: 0.3 to 0.8: 0.3 to 0.8; (B) one or more resins selected from polyimide, polybenzoxazole, a polyimide precursor and a polybenzoxazole precursor; (C) a photoacid generator; (D) a crosslinking agent; and (E) a solvent.SELECTED DRAWING: None

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Inventors:
OSADA HIROHITO
IBE TAKESHI
Application Number:
JP2021099191A
Publication Date:
December 27, 2022
Filing Date:
June 15, 2021
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
G03F7/038; C08G8/12; C08G73/10
Domestic Patent References:
JP2008138128A2008-06-19
JP2009222923A2009-10-01
Foreign References:
WO2021085321A12021-05-06
Attorney, Agent or Firm:
Patent Attorney Corporation Peace International Patent Office



 
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