NEGATIVE PHOTOSENSITIVE SILOXANE RESIN COMPOSITION

Title:

NEGATIVE PHOTOSENSITIVE SILOXANE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2010026360

Kind Code:

A

Abstract:

To provide a negative photosensitive siloxane resin composition which can be subjected to patterning and enables a cured film excellent in wet heat resistance to be formed.

The negative photosensitive siloxane resin composition comprises (a) polysiloxane containing silica particles, (b) a thermal acid generator, (c) a photoacid generator and (d) a solvent.

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Inventors:

FURUKAWA YUMIKO
IIMORI HIROKAZU
SUWA MITSUFUMI

Application Number:

JP2008189491A

Publication Date:

February 04, 2010

Filing Date:

July 23, 2008

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

G03F7/038; G03F7/004; G03F7/075

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