Title:
一体化された電子機器を備えた陰圧創傷治療装置および方法
Document Type and Number:
Japanese Patent JP7443391
Kind Code:
B2
Abstract:
Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a preshaped film material or film. The preshaped film material can be incorporated into the wound dressing and can comprise an aperture configured to permit fluid communication between the absorbent material and the negative pressure source.
Inventors:
Kelby, William
Steward, Daniel, Lee
Steward, Daniel, Lee
Application Number:
JP2021555596A
Publication Date:
March 05, 2024
Filing Date:
March 18, 2020
Export Citation:
Assignee:
SMITH & NEPHEW PUBLIC LIMITED COMPANY
International Classes:
A61M27/00; A61F13/00; A61F13/02
Domestic Patent References:
| JP2018514293A |
Foreign References:
| WO2018060412A1 | ||||
| WO2018060417A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe