Title:
NEGATIVE RADIATION-SENSITIVE COMPOSITION, CURED PATTERN FORMING METHOD AND CURED PATTERN
Document Type and Number:
Japanese Patent JP2010282031
Kind Code:
A
Abstract:
To provide a negative radiation-sensitive composition suitable for forming a cured pattern constituting an interlayer insulating film with a low relative dielectric constant and a high elastic modulus.
The radiation-sensitive composition includes a polysiloxane obtained by hydrolytic condensation of a silane compound comprising an organosilicon compound represented by formula (1) and an organosilicon compound represented by formula (2), an acid generator, a solvent, and an acid diffusion inhibitor, wherein R1 and R5 represent H, F, alkoxyl, alkyl, cyano, cyanoalkyl or alkylcarbonyloxy; R2, R4 and R7 represent a monovalent organic group; and R3 represents a single bond, arylene, methylene or alkylene.
Inventors:
KISHIDA TAKANORI
DEI KEI
YASUDA YOSHITOMO
HASEGAWA KOICHI
DEI KEI
YASUDA YOSHITOMO
HASEGAWA KOICHI
Application Number:
JP2009135552A
Publication Date:
December 16, 2010
Filing Date:
June 04, 2009
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/075; G03F7/004; G03F7/038; G03F7/40; H01L21/027
Domestic Patent References:
| JPH06273936A | 1994-09-30 | |||
| JP2011512023A | 2011-04-14 | |||
| JP2010256501A | 2010-11-11 | |||
| JPH06148895A | 1994-05-27 | |||
| JP2001288364A | 2001-10-16 | |||
| JPH06273936A | 1994-09-30 | |||
| JP2011512023A | 2011-04-14 | |||
| JP2010256501A | 2010-11-11 |
Foreign References:
| WO2005036269A1 | 2005-04-21 | |||
| WO2005036270A1 | 2005-04-21 | |||
| WO2005036269A1 | 2005-04-21 | |||
| WO2005036270A1 | 2005-04-21 |
Attorney, Agent or Firm:
Kiyoshi Kojima
Yoshinobu Hagino
Naoya Taniguchi
Yoshinobu Hagino
Naoya Taniguchi
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