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Title:
NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2009109751
Kind Code:
A
Abstract:

To provide a negative resist composition capable of forming a resist film whose surface has high hydrophobicity and also having good lithography characteristics, and to provide a method of forming a resist pattern.

The negative resist composition includes: a fluorine-containing resin component (F) containing a structural unit (f1) having an alicyclic structure in a main chain and having a fluorinated alkyl ester in a side chain, and a structural unit (f2) having an alkali-soluble group; an alkali-soluble resin component (A) extruding the fluorine-containing resin component (F); an acid generator component (B) that generates acid upon exposure; and a cross-linking component (C).


Inventors:
Iwashita, Atsushi
Sasaki, Kazuhito
Abe, Sho
Application Number:
JP2007000282085
Publication Date:
May 21, 2009
Filing Date:
October 30, 2007
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/038; C08F232/00; H01L21/027
Domestic Patent References:
JP2009098638A2009-05-07
JP2007279663A2007-10-25
JP2007279493A2007-10-25
JP2007025634A2007-02-01
JP2006291177A2006-10-26
JP2006259582A2006-09-28
JP2005514659A2005-05-19
JP2009098638A2009-05-07
JP2007279663A2007-10-25
JP2007279493A2007-10-25
JP2007025634A2007-02-01
JP2006291177A2006-10-26
JP2006259582A2006-09-28
JP2005514659A2005-05-19
Attorney, Agent or Firm:
棚井 澄雄
志賀 正武
鈴木 三義
柳井 則子