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Patent Searching and Data


Title:
NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2006195050
Kind Code:
A
Abstract:

To provide a negative resist composition suppressing swelling of a resist pattern and a resist pattern forming method.

The negative resist composition contains: (A) an alkali-soluble resin component; (B) an acid generator component which generates an acid upon exposure; and (C) a crosslinker component. The alkali-soluble resin component (A) is a copolymer (A1) including: a constitutional unit (a1) having an alicyclic group having a fluorinated hydroxyalkyl group in a backbone; a constitutional unit (a2) having a hydroxyl group-containing chain or cyclic alkyl group and derived from an acrylic ester having a fluorinated alkyl group or a fluorine atom bonding to the α-position; and a constitutional unit (a3) having an alicyclic group having a fluorinated hydroxyalkyl group, and derived from an acrylic ester having a fluorinated alkyl group or a fluorine atom, bonding to the α-position.


Inventors:
IWASHITA ATSUSHI
Application Number:
JP2005005013A
Publication Date:
July 27, 2006
Filing Date:
January 12, 2005
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/038; C08F220/22; C08F232/08; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai