PURPOSE: To provide the negative type resin compsn. which is transparent in a visible light region, is resistant to dry etching and is excellent in sensitivity and resolution by using a polymer having an arom. ring for a base polymer, giving a substituent having an unsatd. group to this arom. ring and using an additive.
CONSTITUTION: The resin compsn. consists of the resin contg. the structural unit in which R in formula I consists of the group contg. unsatd. double bonds and the additive. In the formula, A denotes a benzene ring and/or naphthalene ring; B denotes H, 1 to 4C alkyl group. The negative type photosensitive resin compsn. consisting of the resin having the unsatd. group in the arom. ring and the additive is transparent in the visible light region, is extremely little in the influence of oxygen faults at the time of exposing, is resistant to dry etching and has the high sensitivity and the resist function excellent in the resolution and, therefore, this material is adequate as a coating material and a smoothing resin to be used for solid-state image pickup elements and semiconductor integrated circuit element, etc.
TANAKA TETSUO
FUKAMACHI MASATO
HASEGAWA MASAZUMI
| JPS4915501A | 1974-02-12 | |||
| JPS4946396A | 1974-05-02 | |||
| JPS54135525A | 1979-10-20 | |||
| JPS49107710A | 1974-10-14 | |||
| JPS56122028A | 1981-09-25 | |||
| JPH01105944A | 1989-04-24 | |||
| JPH01263646A | 1989-10-20 |