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Title:
NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND ITS PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH06214390
Kind Code:
A
Abstract:

PURPOSE: To obtain negative type patterns having a high sensitivity and high resolution by using polyamide acid ester, glycine compd., styryl compd. and naphthoquinone diazide compd. which are respectively specific as essential components.

CONSTITUTION: The polyamide acid ester expressed by formula I, the glycine compd. expressed by formula II, the styryl compd. expressed by formula III and the naphthoquinone diazide compd. are used as the essential components. In the formulas, R1 is a trivalent or quadrivalent org. group; R2 denotes a bivalent org. group; R3 denotes-R5-{-O-C-(=0)-C(R6)=CH2}p; R4 is R3 or-CH3, etc.; R5 is bivalent to hexad org. groups; R6 is H or CH3 group; 1 to n are 0 or 1; p is an integer from 1 to 5; x to z are percentages and satisfy 0<x, y<100, 0<z<80, x+y+z=100. R7 is-H,-CH3, etc.; R8 is-H<-C2H5, etc.; R9 is a prescribed arom. group.


Inventors:
BANBA TOSHIO
SASHITA NOBUYUKI
YAMAMOTO MITSUHIRO
TAKEDA NAOJI
Application Number:
JP28472292A
Publication Date:
August 05, 1994
Filing Date:
October 22, 1992
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K5/16; C08K5/19; C08K5/28; C08L79/08; G03F7/004; G03F7/022; G03F7/038; H01L21/027; (IPC1-7): G03F7/038; C08K5/16; C08K5/19; C08K5/28; C08L79/08; G03F7/004; G03F7/022; H01L21/027
Domestic Patent References:
JPH04120543A1992-04-21
JPH03170549A1991-07-24
JPH03210361A1991-09-13
JPH03241356A1991-10-28



 
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