Title:
NET SOLDER
Document Type and Number:
Japanese Patent JPS53122652
Kind Code:
A
Abstract:
PURPOSE: To provide a net solder wherein in covering a semiconductor over a radiating plate, a solder fabricated by filling meshes of a noble metal made network with a powder of molybdenum, tungsten or the like is interposed therebetween, whereby to prevent the generation of splits and cracks in the semiconductor due to thermal expansion.
Inventors:
TAKASHIMA SEIKICHI
Application Number:
JP3721577A
Publication Date:
October 26, 1978
Filing Date:
April 01, 1977
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B23K35/14; B23K35/02; H01L21/52; (IPC1-7): B23K35/00; H01L21/58