Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
NEW COMPOUND, RESIN, PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2011052211
Kind Code:
A
Abstract:

To provide a method for manufacturing a photoresist composition capable of forming a resist pattern having excellent characteristics, a compound providing such a photoresist composition, resin and resist pattern.

The compound is expressed by formula (VII), wherein R0 is H or a methyl group, X21 and X22 are a divalent saturated hydrocarbons, and a methylene group contained in the group may be substituted with O or -CO-, but at least one of the methylene group contained in the X21 and X22 is substituted with -CO-. R21 and R22 are -C(R1R)(R2R)(R3R) group, alicyclic or aromatic hydrocarbon which may be have a substituted group, and the methylene group in the alicyclic hydrocarbon group may be substituted with O, -CO-, S or -SO2-. R1R, R2R and R3R are alkyl groups.


Inventors:
SUGIHARA MASAKO
ICHIKAWA KOJI
ADACHI YUKAKO
YOSHIDA ISAO
Application Number:
JP2010174508A
Publication Date:
March 17, 2011
Filing Date:
August 03, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F20/26; C07C69/732; C07C69/96; C07D307/00; C07D327/06; G03F7/039
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation