NEW COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME

Title:

NEW COMPOUND AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME

Document Type and Number:

Japanese Patent JP2006241269

Kind Code:

A

Abstract:

To provide a compound capable of imparting excellent toughness to an epoxy resin.

This compound has a structure expressed by formula (1), where in the formula, R1 is either of a phenyl group, a substituted phenyl group, a cyclohexyl group or a 1-6C alkyl group; R2 and R3 are each independently a 1-6C alkyl group; n is an integer of 50-1,500; m is an integer of 5-200; and k is an integer of 1-15.

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Inventors:

TAKEYAMA SHUICHI
IIJIMA TAKAO
TOMOI MASAO
OYAMA TOSHIYUKI

Application Number:

JP2005057176A

Publication Date:

September 14, 2006

Filing Date:

March 02, 2005

Export Citation:

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Assignee:

YOKOHAMA RUBBER CO LTD

International Classes:

C08F222/40; C08L35/06; C08L63/00; C08F4/04

Attorney, Agent or Firm:

Nozomi Watanabe
Haruko Sanwa

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