Title:
NEW COPPER COMPLEX AND METHOD FOR PRODUCING COPPER-CONTAINING THIN FILM USING THE SAME COPPER COMPLEX
Document Type and Number:
Japanese Patent JP2007051124
Kind Code:
A
Abstract:
To provide a new copper complex and to provide a method for producing a copper-containing thin film at a lower base temperature.
The copper complex is represented by formula (1) {wherein, R1 and R2 are each as follows. (1) R1 is an ethyl group; and R2 is a methyl group; (2) R1 is an ethyl group; and R2 is a hydrogen atom; or (3) R1 is a t-butyl group; and R2 is a hydrogen atom}. The method for producing the copper-containing thin film is carried out by a chemical vapor deposition method using the copper complex as a copper supply source.
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Inventors:
TSUNODA TAKUMI
HASEGAWA CHIHIRO
KANETO HIROKI
HASEGAWA CHIHIRO
KANETO HIROKI
Application Number:
JP2006039129A
Publication Date:
March 01, 2007
Filing Date:
February 16, 2006
Export Citation:
Assignee:
UBE INDUSTRIES
International Classes:
C07F7/18; C23C16/18; H01L21/28; H01L21/285; C07F19/00