Title:
NEW DIAMINO COMPOUND, POLYAMIC ACID RESIN, POLYAMIC ACID ESTER RESIN, POLYIMIDE RESIN, PRODUCTION THEREOF, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME RESIN, POLYIMIDAZOPYRROLONE RESIN AND POLYIMIDAZOPYRROLONE IMIDE RESIN
Document Type and Number:
Japanese Patent JP3047647
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject new compound useful as a constituent monomer for polyamic acid resins, etc., providing a photosensitive resin composition capable of forming a relief pattern, excellent in developing properties and having high film strength, heat resistance and adhesion.
CONSTITUTION: The objective diamino compound of the formula [x is monovalent photosensitive group; R1 is (2+p)-valent organic group; p is 1 or 2; one (NHCONH-X) group and either of two amino groups are respectively bound to the adjacent two atoms in R1 when p is 1 or two (NHCONH-X) groups are respectively bound to atoms adjacent to separate atoms to which two amino groups are separately bound in R1 when p is 2] e.g. 3',4-bis[3-(2- methacryloyloxyethyl)ureido]-3,4'-diaminobiphenyl. This compound is obtained by adding a vinyl group-containing isocyanate compound such as isocyanatoethyl methacrylate to a polyamino compound such as 4,4'-bis(3,4-diaminophenoxy) biphenyl.
Inventors:
Hideo Hagiwara
Makoto Kaji
Hiroshi Nishizawa
Kenji Suzuki
Yasunori Kojima
Makoto Kaji
Hiroshi Nishizawa
Kenji Suzuki
Yasunori Kojima
Application Number:
JP29856092A
Publication Date:
May 29, 2000
Filing Date:
November 09, 1992
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G73/06; C07C275/40; C08G73/02; C08G73/10; G03F7/027; G03F7/031; G03F7/038; H01L21/027; H01L21/30; (IPC1-7): C08G73/10; C07C275/40; C08G73/06; G03F7/027; G03F7/031; G03F7/038; H01L21/027
Other References:
Ｔｅｔｒａｈｅｄｒｏｎ，Ｖｏｌ．２５，Ｎｏ．１２（１９６９），ｐ．２４２７−２４５４
Attorney, Agent or Firm:
Kunihiko Wakabayashi