Title:
NEW IMIDAZOLESILANE COMPOUND AND ITS PRODUCTION, AND METAL SURFACE TREATING AGENT USING THE SAME
Document Type and Number:
Japanese Patent JPH06256358
Kind Code:
A
Abstract:
PURPOSE: To obtain a new compound as a metal surface treating agent capable of imparting heat resistance and resist adhesiveness to a metal surface.
CONSTITUTION: A compound of formula I (R1 is H or 1-20C alkyl; R2 is H, vinyl or 1-5C alkyl; R3 is 1-3C alkyl). This compound can be obtained by reaction of an imidazole compound of formula II with a 3-glycidoxypropylsilane compound of formula II without using solvent or in an organic solvent (e.g. chloroform) pref. in a moisture-free atmosphere such as in nitrogen or argon gas at 80-200°C. The compound of formula I is useful as a metal surface treating agent for copper, zinc or alloys thereof, esp. for copper foils used in e.g. copper- clad laminates for printed circuits.
Inventors:
TSUCHIDA KATSUYUKI
KUMAGAI MASASHI
OGINO YUKIO
KUMAGAI MASASHI
OGINO YUKIO
Application Number:
JP3990193A
Publication Date:
September 13, 1994
Filing Date:
March 01, 1993
Export Citation:
Assignee:
JAPAN ENERGY CORP
International Classes:
C07F7/10; C09K3/00; C23C22/68; H05K3/38; (IPC1-7): C07F7/10; C09K3/00; C23C22/68
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)