Title:
新規ホスホニウム化合物
Document Type and Number:
Japanese Patent JP7012012
Kind Code:
B2
Abstract:
A heat-curable resin composition characterized by comprising (A) a heat-curable resin, (B) a curing agent and (C) a curing accelerator that is a phosphonium salt composed of two molecules of a phosphonium cation represented by general formula (1) and one molecule of a bivalent anion residue of pyromellitic acid represented by formula (2). The heat-curable resin composition potentially has a property such that the curing accelerator has a poor catalytic activity at a lower temperature and therefore cannot cure the heat-curable resin composition at the lower temperature but exhibits a high catalytic activity at an intended curing temperature and therefore can cure the heat-curable resin composition within a short time at the intended curing temperature. The heat-curable resin composition has excellent storage stability in the form of a one-part preparation, and is colorless and transparent when the curing agent is an acid anhydride.
Inventors:
Masanori Oga
Kenji Ohashi
Kenji Ohashi
Application Number:
JP2018530432A
Publication Date:
January 27, 2022
Filing Date:
July 28, 2017
Export Citation:
Assignee:
Hokuko Chemical Industry Co., Ltd.
International Classes:
C07F9/54; C07C63/313; C08G59/42; C08G59/62; C08G59/68
Domestic Patent References:
| JP64049210A | ||||
| JP7330787A | ||||
| JP2016003243A | ||||
| JP2008179733A | ||||
| JP2015063661A | ||||
| JP2012082271A |
Other References:
エレクロトロニクス実装学会誌,2001年,Vol.4, No.6,p.537-542
Database CAPlus DN 147:437296,2007年,Abstract,& Acta Crystallographica, Section E: Structure Reports Online, 2007, Vol.63, No.2, o1010-o1011
Database CAPlus DN 147:437296,2007年,Abstract,& Acta Crystallographica, Section E: Structure Reports Online, 2007, Vol.63, No.2, o1010-o1011
Attorney, Agent or Firm:
Hidewa Patent Office