To provide a photosensitive resin composition which can be microfabricated owing to its photosensitivity, can be photosensitized with a small exposure amount owing to its high sensitivity, can be developed with a diluted alkaline water solution, can be cured at a low temperature (200C or below), is very flexible, is excellent in electrical insulation reliability, soldering heat resistance, resistance to an organic solvent, and property of adhesion with a sealant, and in which the warpage of a substrate after curing is small.

The problems can be coped with by using the photosensitive resin composition comprising at least: (A) a terminal carboxylic acid urethane imide oligomer; (B) a diamino compound and/or isocyanate based compound; (C) a photosensitive resin; and (D) an oxime ester photopolymerization initiator.