To provide a photosensitive resin composition for alkali developable DFR which retains flexibility of a cured film and adhesion to a substrate and has satisfactory plating resistance.

The photosensitive resin composition contains (A) a photopolymerizable unsaturated compound, (B) a binder polymer having a carboxyl group and (C) a photopolymerization initiator. The component (A) contains a compound of the formula CH2=CR-CO-O-(AO)a-(EO)b-(AO)c-CO-CR'= CH2 (where R and R' are each H or methyl; (a), (b) and (c) are each a number of 1-30; EO is oxyethylene, and (AO)a and (AO)c are each a polyoxyalkylene chain obtained by polymerizing a ≥3C alkylene oxide(AO) or copolymerizing EO and ≥3C AO) as an essential component. A photosensitive element obtained by applying and drying the photosensitive resin on a substrate is provided.