PURPOSE: To obtain the subject resin capable of readily synthesizing a diol component, having a transcyclohexylene group with clear steric configuration as a recurring unit, excellent in heat moldability and heat resistance and capable of forming transparent good film.

CONSTITUTION: A resin of formula I (formula II is transcyclohexylene). This resin of formula I is obtained by mixing trans-1,4-bis(hydroxyphenylacetoxymethyl)cyclohexane of formula III with 2,6- dihydroxynaphthalene of formula IV and 4,4'-dihydroxy-biphenyl of formula V in 1,2-dichloroethane solvent in the presence of pyridine which is an acid acceptor and reacting the mixture with trichloromethyl chloroformate of formula VI. Furthermore, the reaction temperature is preferably 20-100°C and the reaction time is preferably 1-5hr.