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Title:
NEW SUBSTANCE AND THERMOSETTING COMPOSITION
Document Type and Number:
Japanese Patent JP2012107094
Kind Code:
A
Abstract:

To provide a thermosetting composition which enables a cured film with excellent flatness is to be formed while maintaining heat resistance possessed by a cured product of a polyesteramide acid-based thermosetting composition, and to provide a thermosetting composition with excellent low-temperature curability.

A reaction product (A) is obtained by making a dicarboxylic acid anhydride (a1), an amino compound (a2) represented by general formula (1), a hydrolyzable silicon compound (a3) other than the amino compound (a2), and a metal alkoxide (a4) react with one another.


Inventors:
Hotta, Yusaku
Kimura, Yuki
Application Number:
JP2010000255824
Publication Date:
June 07, 2012
Filing Date:
November 16, 2010
Export Citation:
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Assignee:
JNC CORP
International Classes:
C08G79/00; G02B5/20; G02F1/1333
Domestic Patent References:
JPH09279034A1997-10-28
JP2009127022A2009-06-11
JP2009019104A2009-01-29
JPH03126733A1991-05-29
JP2008050490A2008-03-06
JP2008189765A2008-08-21
JPH09291150A1997-11-11
JPH09279034A1997-10-28
JP2009127022A2009-06-11
JP2009019104A2009-01-29
JPH03126733A1991-05-29
JP2008050490A2008-03-06
JP2008189765A2008-08-21
Foreign References:
WO2009096050A12009-08-06
WO2009054508A12009-04-30
WO2009096050A12009-08-06
Attorney, Agent or Firm:
特許業務法人SSINPAT