Title:
NICKEL-PLATED FILM, CUTTING TOOL USING THE NICKEL-PLATED FILM, AND METHOD OF FORMING THE NICKEL-PLATED FILM
Document Type and Number:
Japanese Patent JP2010173015
Kind Code:
A
Abstract:
To provide a nickel plated film used as a coupling member for an electrodeposition cutting tool, in particular, with the excellent retention power of abrasive grains, and to provide the cutting tool using such a nickel-plated film and a method of forming the nickel-plated film.
By applying electroplating using a nickel plating solution as a plating liquid with a current density of 1.0-4.0 A/dm2 to bring an average particle diameter of deposited nickel particles into a range of 0.009-0.5 μm. The cutting tool is constituted so as to have an abrasive grain layer 1 including abrasive grains 3 fixed by the nickel-plated film 2.
Inventors:
OIKAWA NAOTO
ABE HIROAKI
KATASE TAKUMA
ABE HIROAKI
KATASE TAKUMA
Application Number:
JP2009018340A
Publication Date:
August 12, 2010
Filing Date:
January 29, 2009
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B24D3/06; B24D3/00; C25D1/00; C25D15/02; C25D21/12
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Yasuhiko Murayama
Noriko Yanai
Tadashi Takahashi
Yasuhiko Murayama
Noriko Yanai
Previous Patent: MACHINE TOOL
Next Patent: CONDITIONER FOR SEMICONDUCTOR POLISHING CLOTH, METHOD FOR MANUFACTURING THE CONDITIONER FOR SEMICOND...
Next Patent: CONDITIONER FOR SEMICONDUCTOR POLISHING CLOTH, METHOD FOR MANUFACTURING THE CONDITIONER FOR SEMICOND...