Title:
NOBLE METAL PLATED ARTICLE
Document Type and Number:
Japanese Patent JPH0711477
Kind Code:
A
Abstract:
PURPOSE: To provide a noble metal plated article having satisfactory corrosion resistance in various corrosive environments.
CONSTITUTION: An under plating layer 2 of a Cu-Sn-Zn alloy is formed on the surface of stock 1 and a noble metal plating layer 3 is formed on the layer 2 to obtain a noble metal plated article, the amt. of Sn in the under plating layer 2 is regulated to ≥25wt.% and the objective noble metal plated article having excellent corrosion resistance is obtd.
Inventors:
TAKAHASHI KENJI
Application Number:
JP17859793A
Publication Date:
January 13, 1995
Filing Date:
June 28, 1993
Export Citation:
Assignee:
ELECTROPLATING ENG
International Classes:
C23C28/02; C25D5/10; C25D5/12; (IPC1-7): C25D5/10; C23C28/02; C25D5/12
Attorney, Agent or Firm:
Takeshi Takatsuki
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