Title:
NON-CONTACT IC CARD, AGGREGATE AND PRODUCING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3536977
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a structure and a producing method for IC card for mass- producing highly reliable non-contact IC cards at low cost.
SOLUTION: A recessed part formed from a film 3a, on which a prescribed indication is applied, and a resin hole 5b formed on a metallic spacer 5 is filled with a semi-solid resin such as plastic resin, a substrate 1 and an antenna coil 2 are embedded therein, the top of the spacer 5 in such a state is covered with a film 3b, and the resin is hardened by heating. Afterwards, a cutting part 10a shown by a dotted line is punched out by a punching device and the IC card is formed.
Inventors:
Tsumori, Masahiko
Application Number:
JP2000000324507
Publication Date:
March 26, 2004
Filing Date:
December 27, 1994
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B42D15/10; G06K19/07; G06K19/077; B42D15/10; G06K19/07; G06K19/077; (IPC1-7): G06K19/077; B42D15/10; G06K19/07