PURPOSE: To obtain a thin type, high-density card and materialize simplification of a manufacturing process, by a method wherein at least a part of electronic parts out of electronic parts constituting an electronic circuit is constituted of a tape-carrier-package.
CONSTITUTION: A circuit pattern is formed of a copper foil layer 2 by laminating the copper foil layer on a circuit board 1 of a glassy epoxy resin, etc., except for a joining sphere of the electronic parts which is coated with resist 3 and a card circuit board K is formed. Then a cream solder layer 4 is applied to a joining sphere to the electronic parts of the card circuit board K by screen printing, on which the electronic parts such as a TCP type IC chip T and chip parts C are put. Reflow soldering of the card circuit board K on which the electronic parts are put is performed by a well-known heat treatment such as an infrared method or a steam method, through which the card circuit board is formed after that and a non-contact IC card is completed by laminating a plastic on the same board.
SEZAI HIDESHI
MATSUKAWA KOICHI
