To provide a non-contact IC slip of low cost capable of being used in the delivery control of a delivery slip or the like, and a method for using the same.

The non-contact IC slip is a one-part type slip wherein a delivery slip 10B, which is formed from a false adhesive layer 13 and a peeling printing layer 12 in a peelable manner to confirm delivery, and a bonding slip 10C entering the destination are arranged on a plane, and a non-contact IC medium slip 10A, which is provided with a non-contact IC tag 100A performing the giving and receiving of data with an external device in a non-contact state, is provided.